Heilind Asia won the 4th edition EM Best of Industry 2018 - The Best Connectors & Electromechanical Products Distributor Awards from Electronics Maker in Bengaluru, India on September 26th.
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Nepcon Vietnam is a three-day event will be held from 11 to 13 Oct 2018 at SECC in Ho Chi Minh City. Heilind Asia will exhibit at L11, together with TE Connectivity, Alpha Wire, and other suppliers, Heilind Asia will display the latest products and solutions to visitors in Vietnam.
TE Connectivity (TE) provides a wide variety of portable crimp tools. TE's SDE dies can be used across platforms from manual to pneumatic to battery-powered.
TE Connectivity (TE) announced Sliver internal cabled interconnect system provides a solution to data rate increase challenges. It is flexible, robust and provides optimal signal integrity – while also saving space and lowering design costs.
TE Connectivity (TE) offers a full selection of Standard MAG-MATE Insulation Displacement Crimp (IDC) terminals for magnet wire terminations.
TE Connectivity (TE) announced Heavy Duty Sealed Connector Series (HDSCS) which offers several cavity arrangements and mixed wire sizes.
TE Connectivity (TE)'s Mini-SAS HD (high density) product family includes compact, high-speed I/O solutions for SAS applications: storage, rack-mount servers, workstations, storage racks, high performance computing, HBAs (host bus adapters), RAID (redundant arrays of inexpensive disks), switches and more.
TE Connectivity (TE) is building the future of fast with solutions that support speeds up to 100 times those of 4G networks. With exceptionally broader bandwidth and next-generation security, 5G will be integrated into infrastructure, from monitoring power-plants to reinvigorating public transportation. It will create an interactive ecosystem of automated manufacturing, processing, retail, and agriculture.
IDI Consulting Helps Fund Blood Cancer Research and Treatments Through Leukemia & Lymphoma Society's Light The Night Walk